SB-04-4(016) Microstructures and Creep Properties of Al_3Sc with Ternary transition metal additions(Intermetallics and Its Composites)

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概要

• 論文の詳細を見る

• A systematic creep study was undertaken for the binary intermetallic Al_3Sc and the ternary Al_3(Sc_<0.74>X_<0.26>), where X is one of the transition-metals Ti, Y, Zr or Hf. Creep tests were conducted in the temperature range from 673 to 1200 K under a constant compressive stress ranging from 30 to 300 MPa. The binary Al_3Sc exhibits a stress exponent of 4.4-4.9 indicative of creep controlled by climb of dislocations. The activation energy for creep of Al_3Sc was 128±6 kJ/mol, close to that for self-diffusion for pure aluminum, in agreement with the Cu_3Au rule, indicating that diffusion on the Al-sublattice is controlling. Ternary Al_3(Sc_<0.74>X_<0.26>) exhibits a decrease in creep rate by about one order of magnitude for Zr and Hf and by about two orders of magnitude for Ti and Y. For all ternary alloys, a stress exponent of 3.9-5.5 was observed, indicative of dislocation creep. Activation energies for creep of 202±8 kJ/mol were found, showing that ternary substitution for scandium with transition metals affects diffusion on the Al sublattice.

• 一般社団法人日本機械学会の論文
• 2001-06-03

著者

• HARADA Yoshihisa

  Institute for Solid State Physics The University of Tokyo

• Harada Yoshihisa

  Institute For Mechanical Systems Engineering National Institute Of Advanced Industrial Science And T

• Harada Yoshihisa

  Institute For Mechanical Systems Engineering National Institute Of Advanced Industrial Science And T

• DUNAND David

  Department of Materials Science and Engineering, Northwestern University

• Dunand David

  Department Of Materials Science And Engineering Northwestern University

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• SB-04-4(016) Microstructures and Creep Properties of Al_3Sc with Ternary transition metal additions(Intermetallics and Its Composites)

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