基板状に配列したICパッケージの温度分布計算法 : 第1報,パッケージ後流の温度分布

概要

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A superposition approach can be used for predicting cooling performance of IC packages mounted on a printed wiring board. This paper shows a calculating model of the temperature distribution in the thermal wake of a single IC package on a board. The thermal diffusion layor behind a point heat source spreads three-dimensionally. And the temperature distribution in the cross section of the layer is expressed by a cubic expression of the radius in the cross section. In the case of a heated package, the boundary layor on the package is assumed as the linear heat source. The integration of the temperature distribution due to the points in the linear heat source gives the temperature distribution of the wake of the package. The thickness of the diffusion layer was measured experimentally and expressed as a function of the distance from the package.
社団法人日本機械学会の論文
1988-07-25