レーザー周期加熱及び反射率温度測定を用いたウェハ状固体試料間の接触熱コンダクタンスの光学的測定 : 加圧方法の再検討 : 熱工学 , 内燃機関 , 動力

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This paper describes a non-contact optical technique for measuring the thermal contact conductance between thin, wafer-like solid samples. In this technique, one solid surface is heated with a modulated laser beam and the corresponding temperature modulation of the other solid surface across the interface is monitored using the reflectance of a probe laser beam. Since each sample can become slightly bent if its edge is compressed by the sample holder, the contact pressure between the samples in the range of 0.8〜10 MPa is calculated using elastic and plastic numerical analysis. The correlation between the contact pressure and the thermal contact conductance is rearranged to derive the function of the calculated contact pressure. Also, proper thickness of glass boards used to fix samples is derived through the reconsideration of sample loading unit.
2001-03-25