極微粒ダイヤモンド砥粒を用いた多層電着工具の開発

概要

論文の詳細を見る
A multiayered electroplated tool, in which fine diamond grains were plated with deposited nickel ions, was developed for the numerically controlled mirror grinding of free-formed surfaces on dies and molds. An attempt to overcome a disadvantage of the conventional tool, namely, that the tool life was guaranteed for only a short time within which sharp cutting edges of single-layered diamond grains remained in place, was made by plating multilayered diamond grains with nickel ions. In addition, an attempt to prevent the release of diamond grains from the nickel bond matrix was conducted by increasing the grain density of the plated tool. It was confirmed through the plating test that a multilayered electroplated tool with a deposited film thickness of 100 μm and a concentration of 200 could be developed in the case that fine diamond grains of #3000 mesh size were employed. In addition, it was apparent that the isoelectric point on the grain surfaces shifted by covering the grain surfaces with a sputtered metal oxide film so that a high concentration of over 200 could be obtained, due to which, the degree of cohesion of fine grains in the plating bath decreased.
社団法人日本機械学会の論文
2000-03-25