モアレ干渉法による熱サイクル試験下における電子デバイス熱挙動計測

概要

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Electronic devices composed from composite materials are subject to thermal deformation due to environmental temperature change. Thermal deformation caused by the difference in coefficients of thermal expansion of composite materials leads to fatigue failures in micro component. In this paper, thermal strain distribution under thermal cycle test is measured by Moire interferometry, and creep behavior and residual strain of electronic devices are extracted. On the other hand, to evaluate not only the behavior of cross-section but total Devices behavior, measurement of the out-of-plane displacement is tried by applying Moire interferometry.
社団法人日本機械学会の論文
2000-12-25