セラミックスのレーザ割断におけるき裂発生位置の解析的検討

概要

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Laser cleaving is expected to become a new method for cutting inorganic brittle materials such as ceramics and glasses without generating particles or microcracks. However, an initial crack caused by this method often occurs at a short distance from a cutting line. By using computer simulation, we investigated the dependence of crack-initiation behavior on cutting conditions such as beam radius, beam movement velocity, and beam-injection position. The simulation shows that we can reduce the distance between the cutting line and an initial crack by selecting appropriate cutting conditions. When the beam-injecting position is fixed, positioning the injection near the plate edge effectively reduces the distance between the cutting line and the initial crack, while beam radius does not significantly affect the distance. On the other hand, when the beam-injection position is moved during cutting, reducing beam radius and starting the injection at the plate edge or outside of the plate are effective in reducing the distance.
社団法人日本機械学会の論文
2002-03-25