Structural Design of Plastic IC Packages

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概要

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• Recently the size of integrated circuit chips mounted in plastic packages has rapidly increased, while package dimensions have been restricted or made even smaller. This trend has increased mechanical stresses in the packages, which sometimes cause cracking in the plastic encapsulant. In this paper, plastic encapsulant stress analysis by the finite-element method (FEM), special stress-sensing test chips, and plastic resins, silicon chips and bonding wire strengths are reviewed. A fatigue life estimation technique for packages undergoing temperature cycling, quantitative evaluation of solder reflow cracking and a new adhesive strength evaluation method are also examined.

• 一般社団法人日本機械学会の論文
• 1989-07-15

著者

• Kawai Sueo

  Mechanical Engineering Research Laboratory Hitachi Ltd.

関連論文

• Structural Design of Plastic IC Packages
• Stress Analysis of Structures with Cyclic Deformation Mode by Finite Element Method Using Three-dimensional Curved Elements : 2nd Report, Nonlinear Analysis

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