Boundary Element Analysis of Steady-State Heat Conduction and Thermal Stress in the LSI Package

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概要

• 論文の詳細を見る

• Parametric study on the thermal deformation and the thermal stress of a resinmolded package LSI has been performed by a boundary element analysis code specially developed for this study. The length and the position of the Si-chip in the LSI package are employed as the parameters in this study. Boundary element analysis of heat conduction and thermal stress in a steady state is carried out under the uniform temperature condition and the heat-generating condition with the heated chip. It is found that the position to minimize the package deformation is located just below the center of the package; however the stress concentration near the Si-chip corner becomes nearly maximum on the position of the chip under both conditions. In the case of the heated chip, both the thermal stress near the chip corner and the package deformation increase as the chip length becomes large.

• 一般社団法人日本機械学会の論文
• 1990-07-15

著者

• YUUKI Ryoji

  Institute of Industiral Science, University of Tokyo

• SATO Mitsuru

  Central Research Laboratory, Mitsubishi Electric Corporation

• YOSHIOKA Sumio

  Central Research Laboratory, Mitsubishi Electric Corporation

• Yoshioka Sumio

  Central Research Laboratory Mitsubishi Electric Corporation

• Sato Mitsuru

  Central Research Laboratory Mitsubishi Electric Corporation

関連論文

• The Usefulness and Limit of the Direct Regular Method in Boundary Element Elastostatic Analysis : Solid-Mechanisc, Strength of Materials
• On the Usefulness of Mindlin's Solution in Three-Dimensional Boundary Element Analysis
• Boundary Element Analysis of Steady-State Heat Conduction and Thermal Stress in the LSI Package

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