非定常熱応力下ICパッケージの界面はく離を支配する破壊力学パラメータ(<特集>破壊力学)

概要

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In the reflow soldering process, the 1C package is heated over 270℃ by the infrared rays. In a delamination interface, the stress field near a crack tip will always be in a mixed-mode state. It was assumed that the initial defects were generated among the corner part of die pad and epoxy molding compound. The 3-D finite element analysis was carried out to evaluate the strain energy release rate of delamination interface in IC packages subjected to non-steady thermal stress. The strain energy release rate of mixed mode was evaluated by the modified crack-closure integral and virtual crack extension method. The maximum difference of strain energy release rate between the modified crack-closure integral and virtual crack extension method was about 8%. Therefore, it is considered that the modified crack-closure integral is useful as a simple evaluation method of the strain energy release rate. The stress intensity factor K was examined from 3-D and 2-D virtual crack extension method. The virtual crack extension method can evaluate stress intensity factors of the interface crack under a mixed-mode loading accurately.
社団法人日本材料学会の論文
2002-08-15