セラミック材料の熱衝撃抵抗性の評価

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Evaluations of thermal shock resistance, including the onset of crack propagation and progressive crack growth, and examinatins to the deterioration preoperty for tetragonal zirconia polycrystalline (TZP), silicon nitride and silicon carbide owere conducted under various repeated thermal shock conditions. Vickers indented specimens with various surfac flaws sizes were employede for these experiments. The results obtained were summarized as follows: (1) The minimum thermal shock condition required for the onset of crack propagation was propotional to the inverse square root of surface crack length under repeated thermal shock conditions. (2) The actual stress intensity factor K_I of crack near the specimen surface was obtained by using a fracture mechanics formula for semielliptical flaws and making some corrections to the thermal stress value by taking the Biot modulus difference into considerations. As a result, K_I values of TZP, silicon nitride and silicon carbide were found to be about 17〜33%, 17% and 6.9% copared with those calculated without corrections from the surface hals crack length by employiing usual fracture mechanics formula. (3) TZP, which has the largest K_<IC> value and bending strength, showed superior character, when the resistance of material under repeated thermal shock conditions was evaluated by the amount of crack growth per each cycle. Silicon carbide had the smallest resistance under the repeated thermal shock condition.
社団法人日本材料学会の論文
1989-12-15

セラミック材料の熱衝撃抵抗性の評価

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