小型電子管ガラス外囲器の熱衝撃試験に関する研究
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概要
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The failure of glass envelope of miniature electron tubes in the thermal shock tests are discussed in the present paper to control the quality. It is pointed out that the factors of failure are the stress of the glass, the degree of the glass heating, the final shape of the sealed electron tube and the stiffness of the outer pin of the stem. In addition, we have classified the thermal shock test defects of glass envelope according to the above mentioned results. This report is mainly discussed on various methods of thermal shock testing. Their summary runs as follows : (1) If in making the stem the stem glass is strongly tempered, strong radial compression stress is set up, and crack occurs radially across the stem through the pin in the seal-in process. If on the other hand, the stem glass is lightly tempered, strong radial tension stress is set up, and crack occurs tangentially on the circle of the pin through the pin in the seal-in process. The test of upward thermal resistivity against the crack of the stem. The crack of the stem in this test has correlation with the crack of the stem in the seal-in process of the stem and the bulb. (2) In order to make sure of the result of the thermal shock test of the electron tube it is recommended that both upward and downward thermal shock tests will be performed, and it is very important that failure in thermal shock will be avoided by carefully observing the difference in temperature between the upward and the downward testing.
- 社団法人日本材料学会の論文
- 1965-07-15
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