Evaluation of Cu-AIN Joint Brazed with In-Based Active Brazing Filler Metals : Brazing Temperature and Heat Resistance

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概要

• 論文の詳細を見る

• The In-Ti active fillers were examined for joining metallic copper (Cu) to aluminum nitride (AIN) ceramics. Brazing was carried out with In-Ti active brazing filler metals with various compositions, and the microscopic structure and mechanical strength of the Cu-filler-AIN-filler-Cu joint at various temperatures were investigated. When brazed with an In-rich filler of In-1wt%Ti, most of In atoms in the filler were diffused into the Cu plate leaving a Ti-rich reaction layer of 2-4μm thick at the Cu-AIN joint interface. The 4-point bending strength at 500℃ increases linearly with the brazing temperature, whereas the strength at room temperature saturates at 40 MPa. The specimen brazed at 820℃ has the strength of 58 MPa and 33 MPa at 500℃ and 600℃, respectively. On the other hand, when using Ti-rich fillers, e.g., In-7.7wt%Ti, In-15wt%Ti and In-23.8wt%Ti (the same as Ti_3In_4 composition), granular Ti-rich phases were formed at the interface, and the microcracks were observed in the AIN.

• 社団法人日本材料学会の論文
• 2001-09-15

著者

• Miki Toshikatsu

  Department Of Electrical And Electronic Engineering Yamaguchi University

• SASAOKA Hideki

  Department of Electrical and Electronic Engineering, Yamaguchi University

• Sasaoka Hideki

  Department Of Electrical And Electronic Engineering Yamaguchi University

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