Deformation Twinning and Stacking Fault Parameter in Cu-Ni and Cu-Mn Alloys

概要

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Stacking fault parameters of various alloys have been obtained by many workers by using electron microscope and X-ray. According to their studies the concentration of valency electron of solute atom is one of the important factors of controlling the stacking fault parameter of the alloys. that is, the stacking fault energy of an alloy decreases with the increase of the concentration of valency electron. Recently, Vassamilet and Massalski have obtained a slight decrease of the stacking fault energy of Cu-Au alloy with an increase of gold solute. It was reported by one of the authors that the contribution of nickel to stacking fault parameter of copper was very small compared with that in the case of solute element having one or more valency electron, and the stacking fault energy has a decreasing tendency with a slight addition of nickel to copper. It has been considered by Seeger that the stacking fault may be equivalent to a thin twin crystal bounded by two coherent {111} thin boundaries, so the stacking fault energy should be twice that of a coherent twin boundaies. The twinning stress should thus be expected to be hardly changed by the addition of transition metal to copper since the contribution metal to stacking fault parameter of copper is very Small.
社団法人日本物理学会の論文
1964-12-05