The Effect of Surface Layer on the Deformation Process of Copper Single Crystals
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概要
- 論文の詳細を見る
The effect of surface layer on the deformation process of copper single crystalswith various tensile axes has been investigated. The dislocation density of thesurface layer is slightly higher than that of the interior at the yield point and itincreases gradually with increasing strain. In the interior, increasing ratc ofdislocation density is higher and the dislocation tangles are well developedcompared with those in the surface layer. The continuation time of slip tracesobserved by electron microscopy increases with increasing exposure time ofspecimens in air after electropolishing. Furthermore, the amotmt of unloadingyield drop decreases when the surface layer is removed by electropolishing.It is concluded from the results that the surface layer acts as the barrier againstthe mobile dislocation before the yielding but it promotes the deformation afterthe yielding.
- 社団法人日本物理学会の論文
- 1978-10-15
著者
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FUJITA Hiroshi
Research Center for Ultra-High-Voltage Electron Microscopy, Osaka University
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Tabata Teizo
Research Center For Uhvem Osaka University
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Tabata Teizo
Research Center For Ultra-high Voltage Electron Microscopy Osaka University
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KUSUHASHI Hiroshi
Graduate School,Osaka University
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Kusuhashi Hiroshi
Graduate School Osaka University
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Fujita Hiroshi
Research Center For Ultra-high Voltage Electron Microscopy Osaka University
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Fujita Hiroshi
Research Center For Uhvem Osaka University:(present Address)kinki University
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