高周波回路に適用可能な微細導体パターンの構造および MMIC 基板への応用
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概要
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A fine pattern for high frequency use has a serious problem about its RF signal loss. In order to cope with this matter, we proposed a new type of electrode applied by combination of sintering Ag and electroless plating Cu. The pattern is formed by etching a sintering Ag film, and its surface is covered with electroless plating Cu. The design rule is 30/20μm and its thickness is 10μm. Especially, it was a key point that the cross section became corner-less around shape. We found that the RF performance was affected by the thickness and the shape. We confirmed that this electrode is applicable for a new MMIC.
- 社団法人エレクトロニクス実装学会の論文
- 2002-05-01
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- 高周波回路に適用可能な微細導体パターンの構造および MMIC 基板への応用
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