TZP セラミックスの強度に及ぼす研削加工面特性の影響

概要

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In grinding process of fine ceramics, the damaged layer of ground surface relates strongly to the strength of the final product. In this study, TZP was ground in several grinding conditions using several diamond grinding wheels and the effect of grinding and annealing conditions on the ground surface was discussed concerning residual stress and strength. Higher grinding force caused larger compressive residual stress to the ground surface, and resulted in the higher value of Weibull coefficient. However, the annealed test specimen at 1400℃ indicated the highest value of bending strength and Weibull coefficient, because the residual cracks disappeared under the ground surface. On ground surface there were no monoclinic and rhombohedral phase, but the expansion and domain switching of tetragonal phase was found.
公益社団法人精密工学会の論文
1991-08-05