フラクチャマシニングによるセラミックスの高能率研削に関する研究

概要

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The grinding of ceramics with diamond wheels has disadvantages such as low stock removal rates or reduction of the strength of workpieces. This paper describes scratch tests with single point diamond tools and grinding experiments with diamond wheels in order to analyze the grinding mechanism of ceramics and overcome these disadvantages. The following results were obtained. (1) Specific grinding energy of ceramics is strongly correlated with fracture toughness and hardness. (2) Chips are removed as a result of the generation and growth of cracks, so called "fracture machining". (3) Fracture machining is achieved at a high depth of cut, and improves both the stock removal rate and the grinding ratio. (4) The crack layer induced by fracture machining at a 40 μm depth of cut and 20 m/min table speed can be removed by the finished grinding using a #800 diamond wheel and the bending strength of SiC results in recovering up to that of the base material.
公益社団法人精密工学会の論文
1989-07-05