市松格子を用いた二重回折格子法位置合わせ(第1報) : アライメント性能評価

概要

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This paper presents TTL (through the lens) double diffraction grating alignment method using checker grating. An interferometric method, which utilizes a novel pair of grating marks located on the mask and wafer, has been developed. This method have the following characteristics : (1) High S/N alignment signal can also be obtained using many processed wafers. (2) Alignment light doesn't expose the resist on the wafer. (3) The alignment signal is not influenced by defocussing on the wafer. (4) The alignment signal, can also be detected during exposure, and real time alignment is possible. The performances for this method were experimentally evaluated, using several processed wafers. As a result, closer than O.15 μm (3δ) accuracy has been obtained.
公益社団法人精密工学会の論文
1989-07-05