フェーズフィールド法によるAl-1.5mol%Cu合金融解過程の1次元解析

概要

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One-dimensional numerical analysis for the melting process of aluminum 1.5 mol% copper alloy has been carried out using a phase-field model with thin interface limit parameters and the influence of kinetic effect on the melting process was examined. The micro-segregation calculated by the Scheil equation was initially prepared in the calculation area and the system temperature was set to be 915 K, 902 K or 923 K during melting. The melting behavior at each system temperature showed a similar tendency. At the initial stage of melting, the melting rate was large and the steep concentration gradient at the solid side was observed. After that, the concentration gradient continuously decreased and also the solid fraction decreased rapidly with time toward the equilibrium value. The melting rate is affected not by the solute diffusion in solid but by the kinetic effect.
東海大学の論文