Residual Stress and Bonding Strength in the ElectricalSialon Ceramics Joint Made by Using the Brazing Metal Layer

概要

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Electrical Sialons which have some TiN contents were joined with Ag-Cu-Ti active brazing metal layer having a thickness from 30μm to 400μm at a temperature from 1113 K to 1213 K in a vacuum. Residual stress in the brazed joint specimens was not observed when the thickness of brazing metal layer was 30 μ m. However, the residual stress of 80 MPa was detected when the thickness of brazing metal layer increased up to 400μm. When the brazing temperature was 1113 K, four-point bending strengths of 520 MPa and 310 MPa were obtained for the brazed joint specimens with the thicknesses of brazing metal layer of 30 μm and 400 μm, respectively. While the four-point bending strength increased as the brazing temperature was raised. The maximum value of the four-point bending strength was about 700 MPa which was obtained at a condition of the brazing metal thickness of 30μm and the brazing temperature above 1163 K. However, the four-point bending strength decreased with increasing the bending test temperature. A remarkable decrease of the bending strength was observed at the test temperature of 873 K, in which the bending strength was 300 MPa.
秋田大学の論文