半導体レーザを用いた三角測量法による高速三次元計測に関する研究

概要

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In industry, non-contact three dimensional measurements in processes is one of the important demand. Equipments with CCD camera have genellaly been used. But the measurement speed is slow and cost is high. The three dimensional measurement devices based on laser triangulation have been developed. The device consists of a semiconductor laser, poligon mirror and two dimensionalPSD. The signal from PSD is processed by an analog circuit, and the output wave-form is proportional to the cross sectional shape of objects. This device is able to measure the three-dimensional shape of object at high speed. It is a simple structure with low cost and, is suitable for in-process measurements.