Microstructural Evaluation and Ultrasonic Characterization of TLPD bonded 6061-SiCp Composite

スポンサーリンク

概要

• 論文の詳細を見る

• Microstructural evaluation during transient liquid phase diffusion (TLPD) bonding of extruded aluminium based metal matrix composite (6061-15 wt% SiCP) using 50 μm thick copper interlayer was investigated by optical microscopy, scanning electron microscopy (SEM) together with SEM-based energy dispersive X-ray spectroscopy (EDS) and pulse echo ultrasonic test. Microstructural changes in the joint region were examined at five different holding time (20 min, 1 h, 2 h, 3 h and 6 h) for a bonding temperature of 560°C under two different applied pressures (0.1 MPa and 0.2 MPa). Kinetics of the bonding process was significantly accelerated in presence of reinforcement (SiC). This acceleration is attributed to the increased solute diffusivity through defect-rich SiC particle/matrix interface and porosity. The segregated particle at bond interface caused significant attenuation of ultrasonic wave, especially at lower bonding time. The attenuation effect decreased with increasing bonding time as width of particle segregation decreased.

• 社団法人 日本鉄鋼協会の論文
• 2008-05-15

著者

• Pal Tapan

  Welding Technol. Center Dep. Of Metallurgical And Material Engineering Jadavpur Univ.

• Pal Tapan

  Welding Technology Center Department Of Metallurgical And Material Engineering Jadavpur University

• MAITY Joydeep

  Department of Metallurgical and Materials Engineering, National Institute of Technology

• MAITI Rabindranath

  Central Research Facility, Indian Institute of Technology

• Maiti Rabindranath

  Central Research Facility Indian Institute Of Technology

• Maity Joydeep

  Department Of Metallurgical And Materials Engineering National Institute Of Technology

関連論文

• Microstructural Evaluation and Ultrasonic Characterization of TLPD bonded 6061-SiCp Composite

スポンサーリンク