Pulse Propagation Characteristics of a Multi-layered Printed Circuit Board with a Via and a Bump
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概要
- 論文の詳細を見る
In this paper, we numerically analyze the transient response of pulse propagation in a multi-layered printed circuit board with a via and a bump. FDTD method is used for our models. It is found from numerical results that; (1) Even if the lengths of the striplines are equal, pulse waveforms passed through a via and a bump are different according to the direction of the striplines. (2) The propagating pulses are influenced by the pad size connecting the bump rather than the bump size. (3) For the model consisted of a via and a bump pulse distortion of responses are substantially improved, if the smaller bump part (including pads) can be designed.
- 社団法人 電気学会の論文
- 2004-12-01
著者
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Kobayashi D
Department Of Clinical Laboratory Medicine Sapporo Medical University School Of Medicine
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FURUKAWA Shinichi
Sano College
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Hinata T
Nihon Univ. Tokyo Jpn
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Hinata Takashi
College Of Science And Technology Nihon University
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Kobayashi Daisuke
Sano College
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