Nanometer-Scale Metal Plating Using a Scanning Shear-Force Microscope with an Electrolyte-Filled Micropipette Probe

概要

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We describe a novel technique of local metal plating using a scanning probe microscope with a micropipette probe filled with an electrolyte solution. An electrode wire inside the electrolyte-filled micropipette and Si surfaces were employed as the anode and the cathode, respectively. Nanometer-scale Cu dots could be electrochemically deposited on the Si surfaces as the micropipette probe was nearly in contact with the surfaces with application of a dc voltage between the electrode wire and the surfaces. It was possible to control the size of the Cu dots by adjusting the deposition time and voltage. Dot arrays and line patterns were sequentially fabricated as the pipette probe scanned the surfaces while changing the probe-to-surface distance under shear-force control. This technique of local metal plating could allow the fabrication of nanostructures such as nanomachines and nanoelectronics.
公益社団法人応用物理学会の論文
2004-07-15