Improvement of Ta Barrier Film Properties in Cu Interconnection by Using a Non-mass Separated Ion Beam Deposition Method
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-03-01
著者
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一色 実
東北大多元研
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ISHIKAWA Yukio
Department of Radiology, Asahikawa Medical College
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ISHIKAWA Yukiko
Department of Medicine, Institute of Clinical Endocrinology, Tokyo Women's Medical University
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一色 実
東北大工
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ISSHIKI Minoru
Institute of Multidisciplinary Research for Advanced Materials, Tohoku University
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Isshiki Minoru
Instite For Advanced Materials Processing Tohoku University
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Lim Jae-won
Mineral Resources Research Division Korea Institute Of Geoscience & Mineral Resources
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Lim J‐w
Tohoku Univ. Sendai Jpn
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Lim Jae-won
Institute Of Multidisciplinary Research For Advanced Materials Tohoku University
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MIYAKE Kiyoshi
Graduate School of Science and Engineering, Saitama University
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YAMASHITA Mutsuo
Seinan Industries Co. Ltd.
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一色 実
東北大選研
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Miyake Kiyoshi
Graduate School Of Science And Engineering Saitama University
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Ishikawa Yukio
Department Of Pathology School Of Medicine Toho University
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Ishikawa Y
Department Of Substrate Engineering Semiconductor Division Sumitomo Electric Industries Ltd.
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Ishikawa Yukio
Department Of Forestry And Landscape Architecture Hokkaido College Senshu University
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Lim Jae-won
Mineral Resources Res. Div. Korea Inst. Of Geoscience And Mineral Resources
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Ishikawa Yukio
Department Of Clinical Laboratory Sado General Hospital
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ISHIKAWA Yukiko
Department of Medicine, Institute of Clinical Endocrinology, Tokyo Women's Medical University
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