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Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands | 論文著者
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Beenakker Kees
Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands
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Ishihara Ryoichi
Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands
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He Ming
Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands
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Schellevis Hugo
Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands
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Neihof Ellen
Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands
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van Andel
Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands
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Metselaar Wim
Laboratory of Electronic Components, Technology and Materials (ECTM), Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Feldmannweg 17, P.O. Box 5053, 2628 CT Delft, The Netherlands