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Department of Mold and Die Engineering, National Kaohsiung University of Applied Sciences | 論文著者
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CHIOU Shi-Yung
Department of Mold and Die Engineering, National Kaohsiung University of Applied Sciences
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HO Kuen-Sen
Department of Mold and Die Engineering, National Kaohsiung University of Applied Sciences
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WU Cheng-Hsien
Department of Mold and Die Engineering, National Kaohsiung University of Applied Sciences
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CHEN Yu-Wen
Department of Mold and Die Engineering, National Kaohsiung University of Applied Sciences