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Department of Materials Science and Engineering, University of Seoul | 論文
- A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging
- Effect of additive composition on porosity and flexural strength of porous self-bonded SiC ceramics
- Microstructure and Strength of Sn-Bi Coated Sn-3.5mass%Ag Solder Alloy
- Reflection Characteristics of Displacement Deposited Sn for LED Lead Frame