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Department of Materials Science, Denki- Tsushin University | 論文
- Direct Observations of Dislocation Motion in an Al-Mg Solid-Solution Alloy in Three Different Temperature Ranges by HVEM
- Stress-Strain Measurable High-Temperature Tensile Test Device for Use with Electron Microscope
- On the Microwelding of Tensile Test Pieces for Transmission Electron Microscopic Observation
- Fivefold Twinned Small Copper Crystals Grown by Reduction of CuI
- Stress-Extension Behavior of Copper-Tin Alloy Whiskers
- Hydraulic-Type Tensile Device for Transmission Electron Microscopy
- Variational Principle for High-Temperature Plasticity in Alloy-Type Solid Solutions
- Dielectric Absorption in Crystalline Pentachloronitrobenzene