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Anelva Corp. Tokyo Jpn | 論文
- Effects of foil thickness on measurement of grain boundary segregation with FEG-TEM/EDS in austenitic stainless steels
- High-Vacuum Planar Magnetron Sputtering
- Reaction of Copper Oxide and β-Diketone for In situ Cleaning of Metal Copper in a Copper Chemical Vapor Deposition Reactor
- Deposition Rate and Gap Filling Characteristics in Cu Chemical Vapor Deposition with Trimethylvinylsilyl Hexafluoro-acetylacetonate Copper (I)
- Electrode Temperature Effect in Narrow-Gap Reactive Ion Etching
- Optical Emission and Microwave Field Intensity Measurements in Surface Wave-Excited Planar Plasma
- Remote Plasma SiO_2 Deposition by Tetraethoxysilane with Chemically and Energetically Different Atomic Species
- Superiority of O(^1D) atom for solid and gas phase reactions over O(^3P) atom
- Properties of Atomic Oxygen obtained from Thermodynamically Non-equilibrium High Temperature Plasma
- Surface-Wave Sustained Plane Plasmas : Theory and Experiments
- Development of a Fast-Cycle, Extremely High-Vacuum System Using Cryopump
- Study of Deprotection Reaction during Exposure in Chemically Amplified Resists for Lithography Simulation
- Analysis of Deprotection Reaction in Chemically Amplified Resists Using an Fourier Transform Infrared Spectrometer with an Exposure Tool
- Measurement of electron beam broadening in stainless steels during EDS analysis in the FEG-TEM
- Relationship between Hydrophobicity and Structure of Hydrolyzable Tannins, and Association of Tannins with Crude Drug Constituents in Aqueous Solution