Jeon Sung-Ho | School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea

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School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea | 論文

• Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics

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