Sakai Taiji | Electronics Packaging Lab., Fujitsu Laboratories Ltd.
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概要
Electronics Packaging Lab., Fujitsu Laboratories Ltd. | 論文
- A new flip-chip bonding method using ultra-precision cutting of metal/adhesive layers (ICEP2007英文論文特集)
- Effects of a Third Element on Microstructure and Mechanical Properties of Eutectic Sn-Bi Solder