SAITO Go | Kasado Semiconductor Equipment Product Division, Hitachi, Ltd.
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Kasado Semiconductor Equipment Product Division, Hitachi, Ltd. | 論文
- 240-nm Pitch Aluminum Interconnects Formation by UHF-ECR Plasma Etching Incorporating TM Bias and Novel-Gas Chemistry
- Precise CD-Controlled Gate Etching Using UHF-ECR Plasma