Dan Odhiambo | Dept. of Mechanical Engineering, Tohoku Univ.
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概要
Dept. of Mechanical Engineering, Tohoku Univ. | 論文
- OS2(4)-15(OS02W0125) Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves
- OS11(4)-14(OS11W0131) Improvement of Fatigue Strength on Duralumin by Cavitation Shotless Peening