植松 美幸 | 国立医薬品食品衛生研究所 医療機器部|早稲田大学 TWIns|東京女子医科大学 先端生命医科学研究所 先端工学外科学分野
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概要
論文 | ランダム
- Effect of additive metals, Sn, Ga, and In in Ag-Pd-Au-Cu alloys on initial bond strength of 4-META adhesive cement to these alloys
- Measurements of keV-Neutron Capture Cross Sections and Capture Gamma-Ray Spectra of ^Sn
- Synthesis of the Combination Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution
- Approximants in the Ag-In-M and Au-Sn-M (M = Ca or rare earth metals) systems
- Effect of Shear Speed on the Ball Shear Strength of Sn–3Ag–0.5Cu Solder Ball Joints