Hamada Naomi | Department of Mechanical Engineering, Hiroshima Kokusaigakuin University
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論文 | ランダム
- Interfacial reaction between Sn-3.0Ag-0.5Cu solder / Co-P plating and Ni-Co-P plating
- Creep-Fatigue Crack Growth in Sn-3.0Ag-0.5Cu Solder
- Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
- Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
- H-10 EFFECT OF AGING TEMPERATURE ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0% Ag-0.5%Cu and Sn-3.8%Ag-1.0%Cu SOLDERS AND Cu SUBSTRATE(Session: Welding / Joining)